发明授权
- 专利标题： Electronically and ionically conductive porous material and method for manufacture of resin wafers therefrom
- 专利标题（中）： 电子和离子导电多孔材料及其制造树脂晶片的方法
-
申请号： US12288554申请日： 2008-10-21
-
公开(公告)号： US07977395B2公开(公告)日： 2011-07-12
- 发明人: YuPo J. Lin , Michael P. Henry , Seth W. Snyder
- 申请人： YuPo J. Lin , Michael P. Henry , Seth W. Snyder
- 申请人地址： US IL Chicago
- 专利权人： UChicago Argonne, LLC
- 当前专利权人： UChicago Argonne, LLC
- 当前专利权人地址： US IL Chicago
- 代理机构： Olson & Cepuritis, Ltd.
- 主分类号： H01B1/24
- IPC分类号： H01B1/24 ; C08J5/22
摘要：
An electrically and ionically conductive porous material including a thermoplastic binder and one or more of anion exchange moieties or cation exchange moieties or mixtures thereof and/or one or more of a protein capture resin and an electrically conductive material. The thermoplastic binder immobilizes the moieties with respect to each other but does not substantially coat the moieties and forms the electrically conductive porous material. A wafer of the material and a method of making the material and wafer are disclosed.
公开/授权文献
信息查询
