发明授权
- 专利标题： Method for fabricating highly reliable interconnects
- 专利标题（中）： 制造高可靠性互连的方法
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申请号： US11961392申请日： 2007-12-20
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公开(公告)号： US07977241B2公开(公告)日： 2011-07-12
- 发明人: Edward R. Gutierrez , William J. Bellamak , Daniel Davison , Gregory D. Hale , James F. Vannell
- 申请人： Edward R. Gutierrez , William J. Bellamak , Daniel Davison , Gregory D. Hale , James F. Vannell
- 申请人地址： US TX Austin
- 专利权人： Freescale Semiconductor, Inc.
- 当前专利权人： Freescale Semiconductor, Inc.
- 当前专利权人地址： US TX Austin
- 主分类号： H01L21/302
- IPC分类号： H01L21/302 ; H01L21/461
摘要：
A method of fabricating highly reliable tungsten interconnects takes into consideration the effects of charging that can occur within a CMP apparatus due to unrestricted DI water flow, limited only by house supply. Such effects are addressed with the use of a variable pressure input constant flow output in-line controller to the DI water line coupled to the head cleaning loading and unloading module of the CMP apparatus.
公开/授权文献
- US20080153394A1 METHOD FOR FABRICATING HIGHLY RELIABLE INTERCONNECTS 公开/授权日：2008-06-26
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