Invention Grant
- Patent Title: Substrate panel
- Patent Title (中): 基板
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Application No.: US12213793Application Date: 2008-06-24
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Publication No.: US07947909B2Publication Date: 2011-05-24
- Inventor: Hee-Soo Yoon , Chang-Hwan Choi , Soo-Heung Lee , Jong-Soo Yoo , Dal-Hyun Yoo , Ji-Chul An , Jeong-Hoon Park
- Applicant: Hee-Soo Yoon , Chang-Hwan Choi , Soo-Heung Lee , Jong-Soo Yoo , Dal-Hyun Yoo , Ji-Chul An , Jeong-Hoon Park
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2007-0123934 20071130
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
A substrate panel is disclosed. The substrate panel may include a pair of clamp contacts, a plurality of bus lines located between the pair of clamp contacts, and a plurality of substrate units supplied with an electric current by way of the plurality of bus lines, where the bus lines closer to the proximal clamp contact are arranged with larger intervals.
Public/Granted literature
- US20090139747A1 Substrate panel Public/Granted day:2009-06-04
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