Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US11776562Application Date: 2007-07-12
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Publication No.: US07928512B2Publication Date: 2011-04-19
- Inventor: Kun-Hsien Lee , Cheng-Tung Huang , Wen-Han Hung , Shyh-Fann Ting , Li-Shian Jeng , Tzyy-Ming Cheng , Chia-Wen Lang
- Applicant: Kun-Hsien Lee , Cheng-Tung Huang , Wen-Han Hung , Shyh-Fann Ting , Li-Shian Jeng , Tzyy-Ming Cheng , Chia-Wen Lang
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Agent Justin King
- Main IPC: H01L27/12
- IPC: H01L27/12

Abstract:
A semiconductor device is provided herein, which includes a substrate having a first-type MOS transistor, an input/output (I/O) second-type MOS transistor, and a core second-type MOS transistor formed thereon. The semiconductor device further includes a first stress layer and a second stress layer. The first stress layer is disposed on the first-type MOS transistor, or on the first-type MOS transistor and the I/O second-type MOS transistor. The second stress layer is disposed on the core second-type MOS transistor.
Public/Granted literature
- US20070252218A1 SEMICONDUCTOR DEVICE Public/Granted day:2007-11-01
Information query
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