A blister package and a method of forming and filling the blister package are disclosed. The blister package includes a first member having a three-dimensional bubble, a peripheral flange having a major portion and a minor portion, and at least one area bounded by a perforation line which is capable of being broken. The major portion is folded to create at least one channel and the minor portion has a hook hole formed therethrough. A securement mechanism is formed with the minor portion. The securement mechanism includes a hinged tab and first and second cooperating attachment members. The blister package further includes a second member sized and configured to be slideably received within the at least one channel when the securement mechanism is in an open position. The second member is retained within the at least one channel when the securement mechanism is in a closed position.