发明授权
- 专利标题: Sonic fine-hole forming apparatus
- 专利标题(中): 声波微孔成型装置
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申请号: US11988188申请日: 2005-07-04
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公开(公告)号: US07923897B2公开(公告)日: 2011-04-12
- 发明人: Shunro Tachibana , Katsuro Tachibana
- 申请人: Shunro Tachibana , Katsuro Tachibana
- 申请人地址: JP Fukuoka
- 专利权人: Sonopore, Ltd.
- 当前专利权人: Sonopore, Ltd.
- 当前专利权人地址: JP Fukuoka
- 代理机构: Jordan and Hamburg LLP
- 国际申请: PCT/JP2005/012357 WO 20050704
- 国际公布: WO2007/004287 WO 20070111
- 主分类号: H01L41/00
- IPC分类号: H01L41/00 ; A61N1/30
摘要:
Disclosed is a sonic fine-hole forming apparatus for forming a fine-hole in a surface of a membrane or solid body in a liquid by means of sonic energy. The sonic fine-hole forming apparatus is adapted to generate a sonic oscillation driving signal comprises a voltage waveform which has positive and negative voltage portions being asymmetrical, and a sharp peak portion. The sonic fine-hole forming apparatus includes a sonic oscillation section having a surface provided with a covering layer or a protective material having an electrically insulating property and a sonic transparency. The coated layer or a protective material is formed to have a thickness of 10 μm or more. The sonic fine-hole forming apparatus of the present invention can form a fine-hole in a surface of a solid body without using a large-scale apparatus, while suppressing a destructive action around the fine-hole.
公开/授权文献
- US20090127973A1 Sonic fine-hole forming apparatus 公开/授权日:2009-05-21
信息查询
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