发明授权
US07923841B2 Method for bonding semiconductor structure with substrate and high efficiency photonic device manufactured by using the same method
有权
通过使用相同的方法制造的半导体结构与基板和高效光子器件接合的方法
- 专利标题： Method for bonding semiconductor structure with substrate and high efficiency photonic device manufactured by using the same method
- 专利标题（中）： 通过使用相同的方法制造的半导体结构与基板和高效光子器件接合的方法
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申请号： US12426015申请日： 2009-04-17
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公开(公告)号： US07923841B2公开(公告)日： 2011-04-12
- 发明人: Chuan-Cheng Tu
- 申请人： Chuan-Cheng Tu
- 申请人地址： TW Tainan
- 专利权人： RGB Consulting Co., Ltd.
- 当前专利权人： RGB Consulting Co., Ltd.
- 当前专利权人地址： TW Tainan
- 代理机构： Muncy, Geissler, Olds & Lowe, PLLC
- 优先权： TW97114263A 20080418
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/30
摘要：
A method for bonding a semiconductor structure with a substrate and a high efficiency photonic device manufactured by using the same method are disclosed. The method comprises steps of: providing a semiconductor structure and a substrate; forming a composite bonding layer on the semiconductor structure; and bonding the substrate with the composite bonding layer on the semiconductor structure to form a composite alloyed bonding layer. The semiconductor structure includes a compound semiconductor substrate and a high efficiency photonic device is produced after the compound semiconductor substrate is removed. Besides, the composite bonding layer can be formed on the substrate or formed on both the semiconductor structure and substrate simultaneously.
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