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发明授权
US07923830B2 Package-on-package secure module having anti-tamper mesh in the substrate of the upper package 有权
封装在封装上的安全模块，在上部封装的基板中具有防篡改网

Package-on-package secure module having anti-tamper mesh in the substrate of the upper package
摘要：
A package-on-package (POP) secure module includes a first ball grid array (BGA) package and a second BGA package. The first BGA includes an array of bond balls that is disposed on a side of a substrate member, and an array of lands that is disposed on the opposite side of the substrate member. Bond balls of the second BGA are fixed to the lands of the first BGA such that the second BGA is piggy-back mounted to the first BGA. Embedded in the substrate member of the second BGA is an anti-tamper security mesh. An integrated circuit in the first BGA is coupled to, drives and monitors the security mesh. When the module is disposed on a printed circuit board within a point of sale (POS) terminal, the integrated circuit is coupled to, also drives and monitors a second security mesh embedded in the printed circuit board underneath the module.
摘要（中）：

封装封装（POP）安全模块包括第一个球栅阵列（BGA）封装和第二个BGA封装。 第一BGA包括设置在基板构件的侧面上的结合球的阵列，以及设置在基板构件的相对侧上的平台阵列。 第二BGA的粘结球固定到第一BGA的焊盘上，使得第二BGA被背负式安装到第一BGA上。 嵌入在第二BGA的基板部件中的是防篡改安全网。 第一个BGA中的集成电路耦合到驱动和监视安全网。 当模块被布置在销售点（POS）终端的印刷电路板上时，集成电路被耦合到，也驱动和监视嵌在模块下方的印刷电路板中的第二安全网。

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