发明授权
- 专利标题： Integrated circuit package system including shield
- 专利标题（中）： 集成电路封装系统包括屏蔽
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申请号： US12762602申请日： 2010-04-19
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公开(公告)号： US07923822B2公开(公告)日： 2011-04-12
- 发明人: Marcos Karnezos
- 申请人： Marcos Karnezos
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号： H01L23/556
- IPC分类号： H01L23/556
摘要：
An integrated circuit package system includes: a substrate; a first device attached to the substrate; a shield attached to the substrate and surrounding the first device; apertures formed within the shield; the shield configured to block electromagnetic energy that passes through the apertures; and an encapsulation material deposited through the apertures.
公开/授权文献
- US20100200967A1 INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING SHIELD 公开/授权日：2010-08-12
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