发明授权
- 专利标题: Planar magnetic device and power supply IC package using same
- 专利标题(中): 平面磁性器件和电源IC封装使用相同
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申请号: US12091619申请日: 2006-10-26
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公开(公告)号: US07920043B2公开(公告)日: 2011-04-05
- 发明人: Katsutoshi Nakagawa , Tetsuo Inoue , Akira Sato
- 申请人: Katsutoshi Nakagawa , Tetsuo Inoue , Akira Sato
- 申请人地址: JP Tokyo JP Yokohama-Shi
- 专利权人: Kabushiki Kaisha Toshiba,Toshiba Materials Co., Ltd.
- 当前专利权人: Kabushiki Kaisha Toshiba,Toshiba Materials Co., Ltd.
- 当前专利权人地址: JP Tokyo JP Yokohama-Shi
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2005-313311 20051027
- 国际申请: PCT/JP2006/321367 WO 20061026
- 国际公布: WO2007/049692 WO 20070503
- 主分类号: H01F27/28
- IPC分类号: H01F27/28 ; H01F5/00 ; H01F27/24 ; H01F7/06
摘要:
A planar magnetic device 1 includes a first magnetic layer 3 and a second magnetic layer 5 that are made of a mixture of a magnetic powder 7 and a resin, and a planar coil 4 disposed between the magnetic layers. When the planar coil 4 has an adjacent winding interval W between the potions 4c of the coil and the magnetic powder 7 has a maximum particle size L, planar magnetic device 1 satisfies the relationship W>L. In the planar magnetic device 1 having the above structure, fine magnetic powder that can produce a high inductance fills the spaces between the adjacent windings. Thus, the invention can achieve a high-performance planar magnetic device, such as a thin inductor.
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