发明授权
- 专利标题： Semiconductor wafer, semiconductor device, and semiconductor device manufacturing method
- 专利标题（中）： 半导体晶片，半导体器件和半导体器件制造方法
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申请号： US11713436申请日： 2007-03-02
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公开(公告)号： US07919847B2公开(公告)日： 2011-04-05
- 发明人: Atsushi Ebara
- 申请人： Atsushi Ebara
- 申请人地址： JP Tokyo
- 专利权人： Ricoh Company, Ltd.
- 当前专利权人： Ricoh Company, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Cooper & Dunham LLP
- 优先权： JP2006-055998 20060302
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A semiconductor wafer includes a plurality of chip areas, a scribe line area, a bonding pad, a probing pad, and a pad connection wiring. The plurality of chip areas are configured to be arranged in a matrix form. The scribe line area is configured to separate the plurality of chip areas from each other. The bonding pad is configured to be connected with an external terminal. The probing pad is configured to be contacted with a probe wire. The pad connection wiring is configured to electrically connect the bonding pad to the probing pad. The bonding pad and the probing pad are located at a predetermined distance from each other in each of the plurality of chip areas. The pad connection wiring has a portion located in the scribe line area.
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