发明授权
- 专利标题: Conductive masterbatch and resin composition including the same
- 专利标题(中): 导电母料和包含其的树脂组合物
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申请号: US11666761申请日: 2005-10-31
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公开(公告)号: US07914708B2公开(公告)日: 2011-03-29
- 发明人: Norio Tobori , Hideo Komatsu , Kotaro Tanaka , Kazuaki Uchiyama
- 申请人: Norio Tobori , Hideo Komatsu , Kotaro Tanaka , Kazuaki Uchiyama
- 申请人地址: JP Tokyo
- 专利权人: Lion Corporation
- 当前专利权人: Lion Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Kratz, Quintos & Hanson, LLP
- 优先权: JP2004-320612 20041104
- 国际申请: PCT/JP2005/020043 WO 20051031
- 国际公布: WO2006/049139 WO 20060511
- 主分类号: H01B1/06
- IPC分类号: H01B1/06
摘要:
The present invention is to provide a conductive masterbatch using a polyamide resin, the conductive masterbatch that has an excellent kneadability/manufacturability and formability and an excellent dispersibility of conductive fillers such as a carbon black, and shows stable conductivity even when a large amount of such conductive fillers are contained therein, and a resin composition containing the conductive masterbatch. That is, the present invention is to provide the conductive masterbatch, which includes at least a conductive filler selected from carbon blacks and carbon nanotubes, a polyamide resin, and a copolymer which contains at least a vinyl monomer having a functional group reactive with the polyamide resin and a styrene as monomer units, and in which the content of the conductive filler is in the range of 10% by mass to 40% by mass, and the resin composition containing the conductive masterbatch.
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