发明授权
- 专利标题： Rapid cooling system for RTP chamber
- 专利标题（中）： RTP室的快速冷却系统
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申请号： US11226721申请日： 2005-09-14
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公开(公告)号： US07905109B2公开(公告)日： 2011-03-15
- 发明人: Chien Ling Hwang , Yu-Liang Lin , Fu-Kang Tien , Jyh-Chemg Sheu
- 申请人： Chien Ling Hwang , Yu-Liang Lin , Fu-Kang Tien , Jyh-Chemg Sheu
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Tung & Associates
- 主分类号： F25D17/02
- IPC分类号： F25D17/02
摘要：
A rapid cooling system for a rapid thermal processing chamber includes a rapid thermal processing chamber having a wafer support for supporting a wafer. A tank having a supply of cooling liquid is provided in fluid communication with the chamber. A pump is provided in fluid communication with the rapid thermal processing chamber and the tank for pumping the cooling liquid from the tank to the chamber and cooling the wafer during the cooling phase of rapid thermal processing.
公开/授权文献
- US20070056512A1 Rapid cooling system for RTP chamber 公开/授权日：2007-03-15
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