发明授权
- 专利标题: Methods of fabricating vertical twin-channel transistors
- 专利标题(中): 制造垂直双通道晶体管的方法
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申请号: US12651688申请日: 2010-01-04
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公开(公告)号: US07897463B2公开(公告)日: 2011-03-01
- 发明人: Eun-Jung Yun , Sung-Young Lee , Min-Sang Kim , Sung-Min Kim , Hye-Jin Cho
- 申请人: Eun-Jung Yun , Sung-Young Lee , Min-Sang Kim , Sung-Min Kim , Hye-Jin Cho
- 申请人地址: KR
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR
- 代理机构: Myers Bigel Sibley & Sajovec, P.A.
- 优先权: KR2006-74202 20060807
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
A transistor includes first and second pairs of vertically overlaid source/drain regions on a substrate. Respective first and second vertical channel regions extend between the overlaid source/drain regions of respective ones of the first and second pairs of overlaid source/drain regions. Respective first and second insulation regions are disposed between the overlaid source/drain regions of the respective first and second pairs of overlaid source/drain regions and adjacent respective ones of the first and second vertical channel regions. Respective first and second gate insulators are disposed on respective ones of the first and second vertical channel regions. A gate electrode is disposed between the first and second gate insulators. The first and second vertical channel regions may be disposed near adjacent edges of the overlaid source/drain regions.
公开/授权文献
- US20100105181A1 METHODS OF FABRICATING VERTICAL TWIN-CHANNEL TRANSISTORS 公开/授权日:2010-04-29
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