发明授权
- 专利标题： Package substrate including surface mount component mounted on a peripheral surface thereof and microelectronic package including same
- 专利标题（中）： 封装基板包括安装在其外围表面上的表面安装部件和包括其的微电子封装
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申请号： US11851547申请日： 2007-09-07
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公开(公告)号： US07875973B2公开(公告)日： 2011-01-25
- 发明人: Chia-Pin Chiu
- 申请人： Chia-Pin Chiu
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A microelectronic combination and a method of making the combination. The combination includes a package substrate including a substrate body having a peripheral surface and contacts disposed at the peripheral surface; and a surface mount component electrically and mechanically bonded to the contacts.
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