发明授权
- 专利标题: Metal gate structure and method of manufacturing same
- 专利标题(中): 金属门结构及其制造方法
-
申请号: US12154307申请日: 2008-05-21
-
公开(公告)号: US07875519B2公开(公告)日: 2011-01-25
- 发明人: Willy Rachmady , Soley Ozer , Jason Klaus
- 申请人: Willy Rachmady , Soley Ozer , Jason Klaus
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理商 Kenneth A. Nelson
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
A method of manufacturing a metal gate structure includes providing a substrate (110) having formed thereon a gate dielectric (120), a work function metal (130) adjacent to the gate dielectric, and a gate metal (140) adjacent to the work function metal; selectively forming a sacrificial capping layer (310) centered over the gate metal; forming an electrically insulating layer (161) over the sacrificial capping layer such that the electrically insulating layer at least partially surrounds the sacrificial capping layer; selectively removing the sacrificial capping layer in order to form a trench (410) aligned to the gate metal in the electrically insulating layer; and filling the trench with an electrically insulating material in order to form an electrically insulating cap (150) centered on the gate metal.
公开/授权文献
- US20090289334A1 Metal gate structure and method of manufacturing same 公开/授权日:2009-11-26
信息查询
IPC分类: