发明授权
- 专利标题: Solid capacitor and manufacturing method thereof
- 专利标题(中): 固体电容器及其制造方法
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申请号: US12071296申请日: 2008-02-20
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公开(公告)号: US07859824B2公开(公告)日: 2010-12-28
- 发明人: Shang Mei Lee , Ting Keng Lin , Yung Sheng Huang
- 申请人: Shang Mei Lee , Ting Keng Lin , Yung Sheng Huang
- 申请人地址: TW Taipei County
- 专利权人: CTECH Corporation
- 当前专利权人: CTECH Corporation
- 当前专利权人地址: TW Taipei County
- 代理机构: Rosenberg, Klein & Lee
- 优先权: TW94132142A 20050916
- 主分类号: H01G9/025
- IPC分类号: H01G9/025
摘要:
A solid capacitor and the manufacturing method thereof are disclosed. The solid capacitor consists of a dielectric layer and two electrodes. A plurality of holes formed by an opening process is disposed on surface of the dielectric layer. The two electrodes connect with the dielectric layer by the holes. By means of a plurality of high temperature volatile matters, the plurality of holes is formed on surface of the dielectric layer during sintered process. The holes are connected with the outside so as to increase surface area of the dielectric layer and further the capacity is increased. And the solid capacitor stores charge by physical means. Moreover, the solid capacitor can be stacked repeatedly to become a multilayer capacitor.
公开/授权文献
- US20080198533A1 Solid capacitor and manufacturing method thereof 公开/授权日:2008-08-21
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