Invention Grant
- Patent Title: Defect inspection method and system
- Patent Title (中): 缺陷检查方法和系统
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Application No.: US12366956Application Date: 2009-02-06
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Publication No.: US07859656B2Publication Date: 2010-12-28
- Inventor: Sachio Uto , Hiroyuki Nakano , Yukihiro Shibata , Akira Hamamatsu , Yuta Urano
- Applicant: Sachio Uto , Hiroyuki Nakano , Yukihiro Shibata , Akira Hamamatsu , Yuta Urano
- Applicant Address: JP Tokyo
- Assignee: Hitachi high-Technologies Corporation
- Current Assignee: Hitachi high-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2006-054289 20060301
- Main IPC: G01N21/00
- IPC: G01N21/00 ; G01N21/88 ; H01L27/00

Abstract:
An inspection system includes: a facility that uses wide-band illumination light having different wavelengths and single-wavelength light to perform dark-field illumination on an object of inspection, which has the surface thereof coated with a transparent film, in a plurality of illuminating directions at a plurality of illuminating angles; a facility that detects light reflected or scattered from repetitive patterns and light reflected or scattered from non-repetitive patterns with the wavelengths thereof separated from each other; a facility that efficiently detects light reflected or scattered from a foreign matter or defect in the repetitive patterns or non-repetitive patterns or a foreign matter or defect on the surface of the transparent film; and a facility that removes light, which is diffracted by the repetitive patterns, from a diffracted light image of actual patterns or design data representing patterns. Consequently, a more microscopic defect can be detected stably.
Public/Granted literature
- US20090141269A1 Defect Inspection Method And System Public/Granted day:2009-06-04
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