发明授权
- 专利标题: Semiconductor device having super junction
- 专利标题(中): 具有超结的半导体器件
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申请号: US12314786申请日: 2008-12-16
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公开(公告)号: US07859048B2公开(公告)日: 2010-12-28
- 发明人: Yuma Kagata , Jun Sakakibara , Hitoshi Yamaguchi
- 申请人: Yuma Kagata , Jun Sakakibara , Hitoshi Yamaguchi
- 申请人地址: JP Kariya
- 专利权人: Denso Corporation
- 当前专利权人: Denso Corporation
- 当前专利权人地址: JP Kariya
- 代理机构: Posz Law Group, PLC
- 优先权: JP2007-325175 20071217
- 主分类号: H01L29/68
- IPC分类号: H01L29/68
摘要:
A semiconductor device includes: a first semiconductor layer; a PN column layer having first and second column layers; and a second semiconductor layer. Each of the first and second column layers includes first and second columns alternately arranged along with a horizontal direction. The first and second column layers respectively have first and second impurity amount differences defined at a predetermined depth by subtracting an impurity amount in the second column from an impurity amount in the first column. The first impurity amount difference is constant and positive. The second impurity amount difference is constant and negative.
公开/授权文献
- US20090321819A1 Semiconductor device having super junction 公开/授权日:2009-12-31
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