发明授权
- 专利标题: Multilayer printed circuit board
- 专利标题(中): 多层印刷电路板
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申请号: US12350117申请日: 2009-01-07
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公开(公告)号: US07843703B2公开(公告)日: 2010-11-30
- 发明人: Motochika Okano
- 申请人: Motochika Okano
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Blakely, Sokoloff, Taylor & Zafman LLP
- 优先权: JP2008-145181 20080602
- 主分类号: H05K1/11
- IPC分类号: H05K1/11 ; H05K1/14
摘要:
According to one embodiment, a multilayer printed circuit board having a plurality of wiring layers and an electronic component mounted thereon, includes a spiral wire including a path in a substantial spiral shape configured with a printed wire section of a substantial loop shape provided on each of at least two wiring layers of the plurality of wiring layers, and a plug provided on each wiring layer arranged between a top wiring layer which is a wiring layer on a top on which the printed wire section of a substantial loop shape is provided and a bottom wiring layer which is a wiring layer on a bottom on which the printed wire section of a substantial loop shape is provided.
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