Invention Grant
- Patent Title: Arrangement for transporting a flat substrate in a vacuum chamber
- Patent Title (中): 用于在真空室中输送平面基板的布置
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Application No.: US10732179Application Date: 2003-12-10
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Publication No.: US07837799B2Publication Date: 2010-11-23
- Inventor: Stefan Bangert , Frank Fuchs , Uwe Schuessler , Ralph Lindenberg , Tobias Stolley
- Applicant: Stefan Bangert , Frank Fuchs , Uwe Schuessler , Ralph Lindenberg , Tobias Stolley
- Applicant Address: DE Alzenau
- Assignee: Applied Materials GmbH & Co. KG
- Current Assignee: Applied Materials GmbH & Co. KG
- Current Assignee Address: DE Alzenau
- Agency: Fulbright & Jaworski L.L.P.
- Priority: DE10319379 20030430
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23C14/00 ; C23F1/00 ; H01L21/306 ; C25B11/00 ; C25B13/00

Abstract:
An arrangement for transporting a flat substrate through a coating installation, wherein the coating installation comprises, e.g., several and different sputter cathodes, to which the flat substrate, for example a glass pane, is transported one after the other in vacuo. So that no abrasion is generated between glass pane and contact, the glass pane is kept spaced apart from the contact by means of gas pressure. The gas pressure is herein built up through relatively few and small holes in a gas channel. Since during flooding of the coating installation to atmospheric pressure or during evacuation, due to the small holes, no fast pressure equalization between gas channel and the remaining coating installation is possible, the gas channel is decoupled in terms of gas from the remaining coating installation and provided with a separate gas line, via which gas can be introduced into the gas channel or pumped out of it.
Public/Granted literature
- US20050199493A1 Arrangement for transporting a flat substrate in a vacuum chamber Public/Granted day:2005-09-15
Information query
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