Invention Grant
- Patent Title: Heat-dissipating structure applied to at least one portable electronic device
- Patent Title (中): 散热结构应用于至少一个便携式电子设备
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Application No.: US12285180Application Date: 2008-09-30
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Publication No.: US07800903B2Publication Date: 2010-09-21
- Inventor: Jen-Yu Wang
- Applicant: Jen-Yu Wang
- Applicant Address: TW Taipei Hsien
- Assignee: Cooler Master Co., Ltd.
- Current Assignee: Cooler Master Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agency: Rosenberg, Klein & Lee
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20

Abstract:
A heat-dissipating structure includes a support unit and a fan unit disposed in the receiving space. The support unit has a plane portion, a support portion extending downwards from a front side of the plane portion, and an opening passing through the plane portion. The plane portion has a board body, a concave space formed on the top surface of the plane portion, a non-skid pad detachably received in the concave space, a slender block body disposed on a base of the top surface of the board body, and a slender non-skid body disposed on a base of the bottom surface of the board body. The support portion has a support body, a receiving space formed in its inside, a plurality of slender openings formed on two opposite lateral sides of the support body, and a slender non-skid body disposed on a base of the support body.
Public/Granted literature
- US20100079945A1 Heat-dissipating structure applied to at least one portable electronic device Public/Granted day:2010-04-01
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