Invention Grant
- Patent Title: Loop-type heat exchange device
- Patent Title (中): 环型热交换装置
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Application No.: US11308072Application Date: 2006-03-05
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Publication No.: US07775262B2Publication Date: 2010-08-17
- Inventor: Tay-Jian Liu , Chao-Nien Tung , Chuen-Shu Hou , Chih-Peng Lee
- Applicant: Tay-Jian Liu , Chao-Nien Tung , Chuen-Shu Hou , Chih-Peng Lee
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Foxconn Technology Co., Ltd.
- Current Assignee: Foxconn Technology Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Agent Winston Hsu
- Priority: TW94118402A 20050603
- Main IPC: F28D15/00
- IPC: F28D15/00 ; H05K7/20

Abstract:
A loop-type heat exchange device (10) includes an evaporator (20), a vapor conduit (30), a condenser (50) and a liquid conduit (70). The evaporator contains therein a working fluid. The working fluid turns into vapor in the evaporator upon receiving heat from a heat-generating component. The condenser includes a housing member (52), a plurality of tube members (53) being in fluid communication with the housing member, and a fin member (54) maintained in thermal contact with the tube members. The vapor conduit and the liquid conduit are each connected between the evaporator and the condenser. The vapor conduit conveys the vapor generated in the evaporator to the tube members of the condenser. The vapor turns into condensate in the tube members upon releasing the heat to the fin member. The condensate is conveyed back to the evaporator by the liquid conduit.
Public/Granted literature
- US20060272798A1 LOOP-TYPE HEAT EXCHANGE DEVICE Public/Granted day:2006-12-07
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