Invention Grant
- Patent Title: Integration of a microphone array with acoustic echo cancellation and residual echo suppression
- Patent Title (中): 集成麦克风阵列与声学回声消除和残余回波抑制
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Application No.: US11414776Application Date: 2006-04-28
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Publication No.: US07773743B2Publication Date: 2010-08-10
- Inventor: Jack W. Stokes , Chao He , Qin Li , Arungunram C. Surendran
- Applicant: Jack W. Stokes , Chao He , Qin Li , Arungunram C. Surendran
- Applicant Address: US WA Redmond
- Assignee: Microsoft Corporation
- Current Assignee: Microsoft Corporation
- Current Assignee Address: US WA Redmond
- Agency: Klarquist Sparkman, LLP
- Main IPC: H04M9/08
- IPC: H04M9/08

Abstract:
Acoustic echo cancellation, residual echo suppression and sound-source localization/microphone array processes are combined in a two-way voice communication system that uses a microphone array to capture local speech. The processes can be configured according to various alternative architectures and enhancements made to the processes to avoid the adverse effects of non-linear operations in the residual echo suppression on the sound-source localization/microphone array process.
Public/Granted literature
- US20070263850A1 Integration of a microphone array with acoustic echo cancellation and residual echo suppression Public/Granted day:2007-11-15
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