Invention Grant
- Patent Title: Solid-state post-condensation process for increasing the molecular weight of a polyamide
- Patent Title (中): 用于提高聚酰胺分子量的固态后缩合方法
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Application No.: US10501733Application Date: 2003-01-07
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Publication No.: US07767782B2Publication Date: 2010-08-03
- Inventor: Robert C. B. Crombach , Rudy Rulkens
- Applicant: Robert C. B. Crombach , Rudy Rulkens
- Applicant Address: NL Heerlen
- Assignee: DSM IP Assets B.V.
- Current Assignee: DSM IP Assets B.V.
- Current Assignee Address: NL Heerlen
- Agency: Nixon & Vanderhye P.C.
- Priority: EP02075325 20020125
- International Application: PCT/NL03/00003 WO 20030107
- International Announcement: WO03/062302 WO 20030731
- Main IPC: C08G69/28
- IPC: C08G69/28

Abstract:
The invention relates to a process for increasing the molecular weight of a polyamide via solid-state post-condensation by exposing the polyamide in the solid-state at elevated temperature to an inert gas atmosphere, that comprises a step (a) wherein the gas atmosphere to which the polyamide is exposed has a dew temperature Tdew-1, followed by a step (b) wherein the gas atmosphere to which the polyamide is exposed has a dew temperature Tdew-2, whereby Tdew-1 is higher than Tdew-2. The effect is that a high molecular weight polyamide can be obtained in a shorter production time.
Public/Granted literature
- US20050119444A1 Solid-state post-condensation process for increasing the molecular weight of a polyamide Public/Granted day:2005-06-02
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