Invention Grant
- Patent Title: Fluid pump, cooling apparatus and electrical appliance
- Patent Title (中): 流体泵,冷却装置和电器
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Application No.: US11091930Application Date: 2005-03-29
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Publication No.: US07766629B2Publication Date: 2010-08-03
- Inventor: Katsuya Seko , Kenichi Ito
- Applicant: Katsuya Seko , Kenichi Ito
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Pillsbury Winthrop Shaw Pittman, LLP
- Priority: JP2004-099354 20040330
- Main IPC: F04B35/04
- IPC: F04B35/04

Abstract:
A fluid pump having a case with a pump chamber defined by axial side surfaces and a circumferential surface, a suction port and a discharge port both provided in the circumferential surface so as to communicate with the pump chamber, an impeller formed into a disc shape and rotatably mounted in the pump chamber, a pressure generating protrusion, which generates pressure by rotation of the impeller and is located inside the pump chamber at a radial position, and a motor, which drives the impeller, installed in the case and having a stator and a rotor to which the impeller is attached for rotating together.
Public/Granted literature
- US20050232795A1 Fluid pump, cooling apparatus and electrical appliance Public/Granted day:2005-10-20
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