Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US11987501Application Date: 2007-11-30
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Publication No.: US07764564B2Publication Date: 2010-07-27
- Inventor: Hideaki Saito , Hiroaki Ikeda
- Applicant: Hideaki Saito , Hiroaki Ikeda
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: NEC Corporation,Elpida Memory, Inc.
- Current Assignee: NEC Corporation,Elpida Memory, Inc.
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2006-326746 20061204
- Main IPC: G11C8/00
- IPC: G11C8/00

Abstract:
A semiconductor device, which allows a bank interleaving operation by issuing a write command and a read command to different banks while switching them without a waiting time to thereby prevent a drop in data transfer efficiency, is provided. The semiconductor device includes: a memory chip with banks each including at least one memory cell; a logic chip; and data buses, provided corresponding to the banks, for transmitting/receiving write data and read data between the banks and the logic chip. The logic chip includes: a writing data bus for transmitting write data to the memory chip via a data bus; a reading data bus for receiving read data from the memory chip via a data bus; and a switch for, corresponding to a write command or a read command to a bank, connecting the writing data bus or the reading data bus to a data bus connected to the bank.
Public/Granted literature
- US20080133809A1 Semiconductor device Public/Granted day:2008-06-05
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