发明授权
US07760981B2 Manufacturing method of optical waveguide device, optical waveguide device obtained thereby, and optical waveguide connecting structure used for the same 失效
光波导器件的制造方法,由此获得的光波导器件,以及用于其的光波导连接结构

  • 专利标题: Manufacturing method of optical waveguide device, optical waveguide device obtained thereby, and optical waveguide connecting structure used for the same
  • 专利标题(中): 光波导器件的制造方法,由此获得的光波导器件,以及用于其的光波导连接结构
  • 申请号: US12357748
    申请日: 2009-01-22
  • 公开(公告)号: US07760981B2
    公开(公告)日: 2010-07-20
  • 发明人: Masayuki Hodono
  • 申请人: Masayuki Hodono
  • 申请人地址: JP Ibaraki-Shi, Osaka
  • 专利权人: Nitto Denko Corporation
  • 当前专利权人: Nitto Denko Corporation
  • 当前专利权人地址: JP Ibaraki-Shi, Osaka
  • 代理机构: Westerman, Hattori, Daniels & Adrian, LLP
  • 优先权: JP2008-011886 20080122
  • 主分类号: G02B6/10
  • IPC分类号: G02B6/10 G02B6/12
Manufacturing method of optical waveguide device, optical waveguide device obtained thereby, and optical waveguide connecting structure used for the same
摘要:
A method of manufacturing optical waveguide device, comprising steps of: preparing optical waveguide including under cladding layer and protruding core pattern formed on the under cladding layer; preparing mold having protrusions for shaping recesses for fitting with predetermined portions of the core pattern; preparing board provided with light-receiving/emitting element mounted thereon; placing the mold around the light-receiving/emitting element for positioning top surfaces of the protrusions of the mold over light-receiving/emitting portions of the light-receiving/emitting element; filling the mold with sealing resin material and hardening the material in the mold to form sealing resin layer having recesses for fitting with the core pattern; after removing the sealing resin layer from the mold, the core pattern are fitted with the recesses of the resin layer to optically couple the light-receiving/emitting portions and the optical waveguide; and forming an over cladding layer for covering the remaining portion of the core pattern.
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