发明授权
- 专利标题： Exposure apparatus and exposing method and method of manufacturing a printed wiring board
- 专利标题（中）： 曝光装置及曝光方法以及制造印刷电路板的方法
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申请号： US11370044申请日： 2006-03-08
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公开(公告)号： US07760328B2公开(公告)日： 2010-07-20
- 发明人: Yoshihide Yamaguchi , Hiroshi Oyama
- 申请人： Yoshihide Yamaguchi , Hiroshi Oyama
- 申请人地址： JP Ebina-shi
- 专利权人： Hitachi Via Mechanics, Ltd.
- 当前专利权人： Hitachi Via Mechanics, Ltd.
- 当前专利权人地址： JP Ebina-shi
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JP2005-080836 20050322; JP2005-080841 20050322; JP2006-025889 20060202
- 主分类号： G03B27/72
- IPC分类号： G03B27/72
摘要：
The mask-less exposure apparatus includes: a stage which moves with the substrate having a photosensitive resin layer with sensitivity to ultraviolet radiation formed thereon; a first light source for emitting light containing a wavelength component in the wavelength range of 300 to 410 nm; a first light irradiation optical system for modulating a radiant flux emitted from the first light source based on data of a desired exposure pattern to image a pattern on the photosensitive resin layer; a second light source for emitting light containing a wavelength component in the wavelength range of 450 to 2500 nm; and a second light irradiation optical system for guiding a radiant flux emitted from the second light source to a second light irradiation area that is set so as to include at least a first light irradiation area.
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