发明授权
- 专利标题： Ultra-fine area array pitch probe card
- 专利标题（中）： 超细区域阵列俯仰探针卡
-
申请号： US11775732申请日： 2007-07-10
-
公开(公告)号： US07733102B2公开(公告)日： 2010-06-08
- 发明人: Hsu Ming Cheng
- 申请人： Hsu Ming Cheng
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： G01R31/02
- IPC分类号： G01R31/02
摘要：
A system and a method of testing a semiconductor die is provided. An embodiment includes a printed circuit board connected to a space transformation layer, which is connected to a substrate. The substrate uses through silicon vias and a redistribution layer to reduce the pitch of the connections beyond the historical limitations. A probe head using Cobra-style probe pins is connected to the redistribution layer through C4 bumps.
公开/授权文献
- US20090015275A1 Ultra-Fine Area Array Pitch Probe Card 公开/授权日：2009-01-15
信息查询
