Invention Grant
- Patent Title: Apparatus and method for partial ion implantation
- Patent Title (中): 用于部分离子注入的装置和方法
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Application No.: US11957914Application Date: 2007-12-17
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Publication No.: US07728312B2Publication Date: 2010-06-01
- Inventor: Kyong Bong Rouh , Dong Seok Kim
- Applicant: Kyong Bong Rouh , Dong Seok Kim
- Applicant Address: KR Icheon-si
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Icheon-si
- Agency: Marshall, Gerstein & Borun LLP
- Priority: KR10-2007-0065832 20070629
- Main IPC: H01J37/317
- IPC: H01J37/317 ; H01J37/08 ; G21K5/10

Abstract:
An apparatus and method for partial ion implantation, which desirably provide control over the energy of the implanted dopants, generally includes an ion beam generator, and first and second deceleration units. The first deceleration unit decelerates the energy of an ion beam generated by the ion beam generator; and a subsequent, second deceleration unit further decelerates the energy into different energy levels according to regions of a wafer into which the ions are to be implanted.
Public/Granted literature
- US20090001291A1 Apparatus and Method for Partial Ion Implantation Public/Granted day:2009-01-01
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