发明授权
US07684021B2 Method and apparatus for real-time measurement of trace metal concentration in chemical mechanical polishing (CMP) slurry
失效
化学机械抛光（CMP）浆料中痕量金属浓度的实时测量方法和设备
- 专利标题： Method and apparatus for real-time measurement of trace metal concentration in chemical mechanical polishing (CMP) slurry
- 专利标题（中）： 化学机械抛光（CMP）浆料中痕量金属浓度的实时测量方法和设备
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申请号： US11936863申请日： 2007-11-08
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公开(公告)号： US07684021B2公开(公告)日： 2010-03-23
- 发明人: Theodore G. van Kessel
- 申请人： Theodore G. van Kessel
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： McGinn IP Law Group PLLC
- 代理商 Stephen C. Kaufman, Esq.
- 主分类号： G01N21/00
- IPC分类号： G01N21/00
摘要：
A system (and method) for real-time measurement of trace metal concentration in a chemical mechanical polishing (CMP) slurry, includes an electromagnetic radiation flow cell carrying a CMP slurry, a slurry pickup head coupled to the flow cell, and an analyzer for measuring properties of the slurry flowing through the flow cell.
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