Invention Grant
- Patent Title: Microfabrication using patterned topography and self-assembled monolayers
- Patent Title (中): 使用图案形貌和自组装单层的微加工
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Application No.: US11564582Application Date: 2006-11-29
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Publication No.: US07682703B2Publication Date: 2010-03-23
- Inventor: Matthew H. Frey , Khanh P. Nguyen
- Applicant: Matthew H. Frey , Khanh P. Nguyen
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Douglas B. Little
- Main IPC: B32B27/00
- IPC: B32B27/00 ; B29D7/00
Abstract:
A method of selectively and electrolessly depositing a metal onto a substrate having a metallic microstructured surface is disclosed. The method includes forming a self-assembled monolayer on the metallic microstructured surface, exposing the self-assembled monolayer to an electroless plating solution including a soluble form of a deposit metal, and depositing electrolessly the deposit metal selectively on the metallic microstructured surface. Article formed from this method are also disclosed.
Public/Granted literature
- US20070098996A1 MICROFABRICATION USING PATTERNED TOPOGRAPHY AND SELF-ASSEMBLED MONOLAYERS Public/Granted day:2007-05-03
Information query
