A security enclosure and method of forming the security enclosure. The security enclosure includes an electronic assembly, an extension, and a tamper respondent wrap. The extension has a first end inserted in the assembly and a second end having at least one bonding pad thereon. The tamper respondent wrap at least partially surrounds the assembly. The wrap has a bonding pad. The bonding pad of the extension is secured to the bonding pad of the wrap. The tamper respondent wrap includes a plurality of layers. A plurality of electrically conductive lines or a plurality of electrically conductive ink traces exist within each layer of the wrap.