发明授权
- 专利标题： Sensor device and production method therefor
- 专利标题（中）： 传感器装置及其制作方法
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申请号： US12094771申请日： 2006-11-24
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公开(公告)号： US07674638B2公开(公告)日： 2010-03-09
- 发明人: Takafumi Okudo , Yuji Suzuki , Yoshiyuki Takegawa , Toru Baba , Kouji Gotou , Hisakazu Miyajima , Kazushi Kataoka , Takashi Saijo
- 申请人： Takafumi Okudo , Yuji Suzuki , Yoshiyuki Takegawa , Toru Baba , Kouji Gotou , Hisakazu Miyajima , Kazushi Kataoka , Takashi Saijo
- 申请人地址： JP Osaka
- 专利权人： Panasonic Electric Works Co., Ltd.
- 当前专利权人： Panasonic Electric Works Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Cheng Law Group, PLLC
- 优先权： JP2005-341223 20051125; JP2005-341225 20051125; JP2005-341253 20051125; JP2005-371049 20051222; JP2005-371053 20051222; JP2006-089555 20060328; JP2006-089558 20060328; JP2006-089582 20060328; JP2006-089583 20060328; JP2006-089586 20060328; JP2006-089589 20060328
- 国际申请： PCT/JP2006/323459 WO 20061124
- 国际公布： WO2007/061059 WO 20070531
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; H01L23/58 ; G01R31/26
摘要：
A compact sensor device having stable sensor characteristics and the production method are provided. The sensor device is formed with a sensor substrate and a pair of package substrates bonded to both surface of the sensor substrate. The sensor substrate has a frame with an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion. Surface-activated regions are formed on the frame of the sensor substrate and the package substrates by use of an atomic beam, an ion beam or a plasma of an inert gas. By forming a direct bonding between the surface-activated regions of the sensor substrate and each of the package substrates at room temperature, it is possible to avoid inconvenience resulting from residual stress at the bonding portion.
公开/授权文献
- US20090152656A1 SENSOR DEVICE AND PRODUCTION METHOD THEREFOR 公开/授权日：2009-06-18
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