Invention Grant
- Patent Title: Substrate damage detection mechanism using RFID tag
- Patent Title (中): 使用RFID标签的基板损伤检测机制
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Application No.: US11512281Application Date: 2006-08-30
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Publication No.: US07663491B2Publication Date: 2010-02-16
- Inventor: Chi-Kuang Hwang , In-Hang Chung , Chih-Hu Wang , Ching-Cheng Tien , Bore-Kuen Lee , Tung-Chou Chen , Chia-Wen Wu , Chien-Jung Chiu , Ming-Ching Yen , Jwu-E Chen
- Applicant: Chi-Kuang Hwang , In-Hang Chung , Chih-Hu Wang , Ching-Cheng Tien , Bore-Kuen Lee , Tung-Chou Chen , Chia-Wen Wu , Chien-Jung Chiu , Ming-Ching Yen , Jwu-E Chen
- Applicant Address: TW Hsin Chu
- Assignee: Chung Hua University
- Current Assignee: Chung Hua University
- Current Assignee Address: TW Hsin Chu
- Agency: Rosenberg, Klein & Lee
- Main IPC: G08B13/14
- IPC: G08B13/14 ; B60R25/10 ; H04Q5/22 ; H01Q1/32 ; G01M17/00

Abstract:
Disclosed is a substrate damage detection mechanism using Radio Frequency Identification (RFID) tag including a substrate, at least one RFID tag with a RFID chip, a RFID transmitter and at least one data input/output port and at least one conducting circuit loop arranged to cover the substrate and provided with a first end that is electrically connected to a reference voltage and a second end that is electrically connected to the data input/output port of the RFID tag. The RFID chip generates a conductive code when the conducting circuit loop is originally conducting and generates a open-circuit code when the conducting circuit loop becomes open circuit resulting from the damage of the substrate in which both the conductive code and the open-circuit code are transmitted by the RFID transmitter and received by a RFID reader to determine the damage of the substrate.
Public/Granted literature
- US20080061972A1 Substrate damage detection mechanism using RFID tag Public/Granted day:2008-03-13
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