- 专利标题： Branching filter package
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申请号： US11978671申请日： 2007-10-30
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公开(公告)号： US07602263B2公开(公告)日： 2009-10-13
- 发明人: Wataru Ohashi , Hajime Shimamura , Tomokazu Komazaki , Yoshiaki Fujita
- 申请人： Wataru Ohashi , Hajime Shimamura , Tomokazu Komazaki , Yoshiaki Fujita
- 申请人地址： JP Tokyo
- 专利权人： Oki Semiconductor Co., Ltd.
- 当前专利权人： Oki Semiconductor Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Venable LLP
- 代理商 Michael A. Sartori; Kyle D. Petaja
- 优先权： JP10-160088 19980609; JP11-149959 19990528
- 主分类号： H03H9/72
- IPC分类号： H03H9/72
摘要：
A branching filter package has a SAW filter chip housing area which houses a piezo electric base, on which a transmitting SAW filter and a receiving SAW filter having a different frequency passing band with each other, are formed, and an impedance matching circuit and a branching circuit for the transmitting SAW filter and the receiving SAW filter.
公开/授权文献
- US20080136556A1 Branching filter package 公开/授权日：2008-06-12
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