发明授权
- 专利标题： Structure of polymer-matrix conductive film and method for fabricating the same
- 专利标题（中）： 聚合物基体导电膜的结构及其制造方法
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申请号： US10998741申请日： 2004-11-30
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公开(公告)号： US07598609B2公开(公告)日： 2009-10-06
- 发明人: Ruoh Huey Uang , Yu Chih Chen , Ren Jay Lin , Syh Yuh Cheng
- 申请人： Ruoh Huey Uang , Yu Chih Chen , Ren Jay Lin , Syh Yuh Cheng
- 申请人地址： TW Hsin Chu
- 专利权人： Industrial Technology Research Institute
- 当前专利权人： Industrial Technology Research Institute
- 当前专利权人地址： TW Hsin Chu
- 代理机构： Bacon & Thomas, PLLC
- 优先权： TW93130523A 20041008
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L35/24 ; H01L23/48
摘要：
A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel and spaced apart from each other so as to provide anisotropic conductivity. The present conductive film can serve as an electrical connection between a fine-pitch chip and a substrate. Additionally, an adhesive layer is formed on two opposite sides of the conductive film along its conductive direction to increase adhesive areas. The strength and reliability of the package using the conductive film are thus enhanced.
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