发明授权
US07550840B2 Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof 有权
用于实现裸模微电子器件的可靠传热的装置及其方法

Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof
摘要:
Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die microelectronic device; and, a force applying mechanism that compression loads, under controlled forces, a surface of the bare die into a direct heat transfer relationship at a thermal interface with a heat sink assembly.
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