发明授权
- 专利标题: Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof
- 专利标题(中): 用于实现裸模微电子器件的可靠传热的装置及其方法
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申请号: US11766997申请日: 2007-06-22
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公开(公告)号: US07550840B2公开(公告)日: 2009-06-23
- 发明人: John Lee Colbert , Justin Christopher Rogers , Arvind Kumar Sinha
- 申请人: John Lee Colbert , Justin Christopher Rogers , Arvind Kumar Sinha
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理商 Matthew C. Zehrer
- 主分类号: H01L23/34
- IPC分类号: H01L23/34
摘要:
Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die microelectronic device; and, a force applying mechanism that compression loads, under controlled forces, a surface of the bare die into a direct heat transfer relationship at a thermal interface with a heat sink assembly.
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