Invention Grant
US07514540B2 Functionalized carrier material containing covalently bound biomolecule via a linker
失效
通过接头含有共价结合的生物分子的官能化载体材料
- Patent Title: Functionalized carrier material containing covalently bound biomolecule via a linker
- Patent Title (中): 通过接头含有共价结合的生物分子的官能化载体材料
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Application No.: US10451652Application Date: 2001-12-03
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Publication No.: US07514540B2Publication Date: 2009-04-07
- Inventor: Pablo Wessig , Jürgen Bendig , Uwe Schedler
- Applicant: Pablo Wessig , Jürgen Bendig , Uwe Schedler
- Applicant Address: DE Berlin
- Assignee: Poly-An Gesellschaft zur Herstellung Von Polymeren Fuer Spezielle Anwendungen und Analytik mbH
- Current Assignee: Poly-An Gesellschaft zur Herstellung Von Polymeren Fuer Spezielle Anwendungen und Analytik mbH
- Current Assignee Address: DE Berlin
- Agency: Kriegsman & Kriegsman
- Priority: DE10065787 20001222
- International Application: PCT/EP01/14072 WO 20011203
- International Announcement: WO02/051872 WO 20020704
- Main IPC: C07K1/00
- IPC: C07K1/00 ; C07K17/14 ; C07K17/10 ; C07K17/08 ; C07K17/06 ; C12N11/14 ; C12N11/10 ; C12N11/06

Abstract:
The invention concerns a method for immobilizing biomolecules on a polymeric surface of a carrier material and a carrier material functionalized with a biomolecule according to the general formulas (IV) and (V), which can be produced according to the method, wherein P indicates the polymeric surface of the carrier material and M indicates the biomolecule bound to the linker compound via an amino group (formula IV) or a carbonyl group (formula V) and R2 has the meaning OR4 or NR4R5; R1, R4 and R5, independently of one another, indicate H, and alkyl group or an aryl group; R3 indicates H, an alkyl, an aryl, an acyl, an alkoxycarbonyl or an aryloxycarbonyl group; and the alkyl, aryl, acyl, alkoxycarbonyl and/or aryloxycarbonyl group of the radicals R1, R3, R4 and R5, independently of one another, are substituted or unsubstituted.
Public/Granted literature
- US20040132149A1 Method for immobilising biomelocules, functionalized carrier material, and the use thereof Public/Granted day:2004-07-08
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