Invention Grant
- Patent Title: Header-replaceable hybrid waveguide sensor
- Patent Title (中): 头可更换混合波导传感器
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Application No.: US11896309Application Date: 2007-08-30
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Publication No.: US07512293B2Publication Date: 2009-03-31
- Inventor: Soo Jin Jung , Il Kweon Joung , Dong Ho Shin , Won Hoe Koo , Gwan Su Lee
- Applicant: Soo Jin Jung , Il Kweon Joung , Dong Ho Shin , Won Hoe Koo , Gwan Su Lee
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2006-0082883 20060830
- Main IPC: G02B6/26
- IPC: G02B6/26

Abstract:
A header-replaceable hybrid waveguide sensor comprises a header coupling section including a dielectric layer having an optical signal input section and an optical signal output section formed in one end thereof, the dielectric layer having two lines of protrusions formed on the upper surface thereof; and a polymer layer formed on and under the dielectric layer; and a sensor header including a dielectric layer having a protrusion formed on the upper surface thereof and a predetermined size of thin metal film provided therein; a polymer layer formed on and under the dielectric layer and having an opening formed in a portion corresponding to the thin metal film, the opening having a larger width than the thin metal film; and a receptor layer formed on the upper surface of the dielectric layer exposed by the opening.
Public/Granted literature
- US20080056641A1 Header-replaceable hybrid waveguide sensor Public/Granted day:2008-03-06
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