Invention Grant
- Patent Title: Modular architecture sensing and computing platform
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Application No.: US11701904Application Date: 2007-02-02
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Publication No.: US07490769B2Publication Date: 2009-02-17
- Inventor: Donald R. Hall
- Applicant: Donald R. Hall
- Agency: Greenblum & Bernstein, P.L.C.
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
A weather resistant modular sensor and computing platform reduces costs and enhances versatility of sensor systems. Rapidly evolving electronic technology results in hyper-obsolescence wherein sensor systems that are state of the art technology when designed, fall behind the art quickly as new transducers, batteries and components are developed. A cylindrical shaped modular system provides an architecture for up-grading sensors, batteries, special modules, communications, and control. A modular architecture extends the life cycle of a system and avoids hyper-obsolescence and the requirement to design a complete new system to incorporate new technology. Modularity and low cost manufacturing methods enable the practical definition of a cylindrical computer. The cylinder shaped enclosures have on their ends a common connection interface to which modules may be added. This provides a long system life cycle and wide ranging versatility. The size of the platform is not restricted. Larger systems are capable of supporting more sophisticated processing. A scaled up version of the modular platform provides an outdoor weather resistant community computing server.
Public/Granted literature
- US20070131756A1 Modular architecture sensing and computing platform Public/Granted day:2007-06-14
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