Invention Grant
US07472743B2 Liquid cooling system suitable for removing heat from electronic components 失效
液体冷却系统适用于从电子部件中除去热量

  • Patent Title: Liquid cooling system suitable for removing heat from electronic components
  • Patent Title (中): 液体冷却系统适用于从电子部件中除去热量
  • Application No.: US11308375
    Application Date: 2006-03-20
  • Publication No.: US07472743B2
    Publication Date: 2009-01-06
  • Inventor: Tay-Jian LiuChih-Peng Lee
  • Applicant: Tay-Jian LiuChih-Peng Lee
  • Applicant Address: TW Tu-Cheng City, Taipei Hsien
  • Assignee: Foxconn Technology Co., Ltd.
  • Current Assignee: Foxconn Technology Co., Ltd.
  • Current Assignee Address: TW Tu-Cheng City, Taipei Hsien
  • Agent Winston Hsu
  • Priority: CN200510034565 20050507
  • Main IPC: H05K7/20
  • IPC: H05K7/20
Liquid cooling system suitable for removing heat from electronic components
Abstract:
A liquid cooling system (100) for removing heat from a heat-generating component is disclosed. The liquid cooling system includes a heat-absorbing member (20), a heat-dissipating member (30), a pump (50) and a mounting mechanism (10, 60). The heat-absorbing member defines therein a fluid flow channel (26) for passage of a coolant. The pump is in fluid communication with the heat-absorbing member and the heat-dissipating member for driving the coolant to circulate between the heat-absorbing member and the heat-dissipating member. The mounting mechanism includes a bottom portion (10) and a top portion (60) cooperating with the bottom portion to define therebetween a receiving space. The heat-absorbing member, heat-dissipating member and pump are received in the receiving space and are mounted to the mounting mechanism.
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