Invention Grant
- Patent Title: Method and device for demolding
- Patent Title (中): 用于脱模的方法和装置
-
Application No.: US11291853Application Date: 2005-12-02
-
Publication No.: US07462320B2Publication Date: 2008-12-09
- Inventor: Yu-Lun Ho , Jen-Hua Wu , Wei-Han Wang , Shou-Ren Chen , Lai-Sheng Chen
- Applicant: Yu-Lun Ho , Jen-Hua Wu , Wei-Han Wang , Shou-Ren Chen , Lai-Sheng Chen
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: WPAT., P.C.
- Agent Justin King
- Priority: TW94137286A 20051025
- Main IPC: B28B7/10
- IPC: B28B7/10 ; B29C43/50

Abstract:
The present invention relates to a demolding method and device, being used for detaching a mold and a substrate after completing an imprinting process, in which the mold is forced to detach from the substrate partially and form a gap therebetween by inserting at least a blade module between the two, and thus, as air is sucked into the gap and the adhesion force of vacuum effect exerting between the mold and the substrate is eliminated, the blade module is further applied to detach the mold from the substrate completely.
Public/Granted literature
- US20070092594A1 Method and device for demolding Public/Granted day:2007-04-26
Information query