Invention Grant
- Patent Title: Cooling devices that use nanowires
- Patent Title (中): 使用纳米线的冷却装置
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Application No.: US11126430Application Date: 2005-05-10
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Publication No.: US07449776B2Publication Date: 2008-11-11
- Inventor: Shih-Yuan Wang , M. Saif Islam , Philip J. Kuekes
- Applicant: Shih-Yuan Wang , M. Saif Islam , Philip J. Kuekes
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H01L23/38
- IPC: H01L23/38 ; H01L23/473
Abstract:
Different types of cooling devices using nanowires are described. For example, a cooling device may include a plurality of diamond nanowires coupled to a surface. The diamond nanowires conduct heat energy from the surface and dissipate the heat energy into a neighboring fluid.
Public/Granted literature
- US20060255452A1 Cooling devices that use nanowires Public/Granted day:2006-11-16
Information query
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