Invention Grant
US07435609B2 Manufacturing method for exposure mask, generating method for mask substrate information, mask substrate, exposure mask, manufacturing method for semiconductor device and server
有权
曝光掩模的制造方法,掩模基板信息的生成方法,掩模基板,曝光掩模,半导体装置和服务器的制造方法
- Patent Title: Manufacturing method for exposure mask, generating method for mask substrate information, mask substrate, exposure mask, manufacturing method for semiconductor device and server
- Patent Title (中): 曝光掩模的制造方法,掩模基板信息的生成方法,掩模基板,曝光掩模,半导体装置和服务器的制造方法
-
Application No.: US11147232Application Date: 2005-06-08
-
Publication No.: US07435609B2Publication Date: 2008-10-14
- Inventor: Masamitsu Itoh
- Applicant: Masamitsu Itoh
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2001-164695 20010531
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
There is disclosed a manufacturing method for exposure mask, which comprises acquiring a first information showing surface shape of surface of each of a plurality of mask substrates, and a second information showing the flatness of the surface of each of mask substrates before and after chucked on a mask stage of an exposure apparatus, forming a corresponding relation of each mask substrate, the first information and the second information, selecting the second information showing a desired flatness among the second information of the corresponding relation, and preparing another mask substrate having the same surface shape as the surface shape indicated by the first information in the corresponding relation with the selected second information, and forming a desired pattern on the above-mentioned another mask substrate.
Public/Granted literature
Information query
IPC分类: