发明授权
US07372166B2 Sublithographic contact structure, phase change memory cell with optimized heater shape, and manufacturing method thereof
有权
亚光刻接触结构,具有优化的加热器形状的相变存储单元及其制造方法
- 专利标题: Sublithographic contact structure, phase change memory cell with optimized heater shape, and manufacturing method thereof
- 专利标题(中): 亚光刻接触结构,具有优化的加热器形状的相变存储单元及其制造方法
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申请号: US11258340申请日: 2005-10-24
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公开(公告)号: US07372166B2公开(公告)日: 2008-05-13
- 发明人: Giulio Casagrande , Roberto Bez , Fabio Pellizzer
- 申请人: Giulio Casagrande , Roberto Bez , Fabio Pellizzer
- 申请人地址: IT Agrate Brianza
- 专利权人: STMicroelectronics S.r.l.
- 当前专利权人: STMicroelectronics S.r.l.
- 当前专利权人地址: IT Agrate Brianza
- 代理机构: Seed IP Law Group PLLC
- 代理商 Lisa K. Jorgenson; Robert Iannucci
- 优先权: EP02425088 20020220
- 主分类号: H01L23/48
- IPC分类号: H01L23/48
摘要:
An electronic semiconductor device has a sublithographic contact area between a first conductive region and a second conductive region. The first conductive region is cup-shaped and has vertical walls which extend, in top plan view, along a closed line of elongated shape. One of the walls of the first conductive region forms a first thin portion and has a first dimension in a first direction. The second conductive region has a second thin portion having a second sublithographic dimension in a second direction transverse to the first dimension. The first and the second conductive regions are in direct electrical contact at their thin portions and form the sublithographic contact area. The elongated shape is chosen between rectangular and oval elongated in the first direction. Thereby, the dimensions of the contact area remain approximately constant even in presence of a small misalignment between the masks defining the conductive regions.
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