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发明授权
US07361979B2 Multi-sheet conductive substrates for microelectronic devices and methods for forming such substrates 有权
用于微电子器件的多片导电衬底以及用于形成这种衬底的方法

Multi-sheet conductive substrates for microelectronic devices and methods for forming such substrates
摘要：
A substrate is provided having a plurality of sheets. Each sheet has a first major surface containing a plurality of electrically conductive regions and a second major surface that opposes the first major surface. The sheets are arranged such that the first major surface of a sheet faces the second major surface of another. At least one electrically conductive region of each sheet is partially or fully exposed. At least one electrically conductive region of a sheet is partially or fully covered, e.g., by one or more electrically conductive regions of another sheet. A method for forming such a substrate is also provided.
摘要（中）：

提供具有多个片材的基片。 每个片材具有包含多个导电区域的第一主表面和与第一主表面相对的第二主表面。 片材布置成使得片材的第一主表面面对另一片材的第二主表面。 每个片材的至少一个导电区域部分或全部暴露。 片材的至少一个导电区域被部分或完全覆盖，例如由另一片材的一个或多个导电区域覆盖。 还提供了一种用于形成这种基板的方法。

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