Invention Grant
- Patent Title: Method for molding running board with step plate
- Patent Title (中): 用踏板成型跑步板的方法
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Application No.: US10673316Application Date: 2003-09-30
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Publication No.: US07332120B2Publication Date: 2008-02-19
- Inventor: Timothy W. Chapman , Changize Sadr
- Applicant: Timothy W. Chapman , Changize Sadr
- Applicant Address: CA Weston, Ontario
- Assignee: Salflex Polymers Ltd.
- Current Assignee: Salflex Polymers Ltd.
- Current Assignee Address: CA Weston, Ontario
- Agency: Bereskin & Parr
- Main IPC: B29C49/20
- IPC: B29C49/20

Abstract:
A process for making a molded running board assembly for installation on a vehicle includes blow molding the body of the running board and incorporating one or more additional components such as a step plate or a trim strip. The process involves placing the insert into the blow mold cavity in a subcavity, holding the insert by vacuum pressure and then extruding and blow molding a parison to simultaneously mold the running board and integrate the insert.
Public/Granted literature
- US20050067741A1 Method for molding running board with step plate Public/Granted day:2005-03-31
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