Invention Grant
US07297989B2 Diboride single crystal substrate, semiconductor device using this and its manufacturing method
失效
二硼化物单晶基板,使用这种半导体器件及其制造方法
- Patent Title: Diboride single crystal substrate, semiconductor device using this and its manufacturing method
- Patent Title (中): 二硼化物单晶基板,使用这种半导体器件及其制造方法
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Application No.: US10525753Application Date: 2003-08-21
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Publication No.: US07297989B2Publication Date: 2007-11-20
- Inventor: Shigeki Otani , Hiroyuki Kinoshita , Hiroyuki Matsunami , Jun Suda , Hiroshi Amano , Isamu Akasaki , Satoshi Kamiyama
- Applicant: Shigeki Otani , Hiroyuki Kinoshita , Hiroyuki Matsunami , Jun Suda , Hiroshi Amano , Isamu Akasaki , Satoshi Kamiyama
- Applicant Address: JP Ibaraki JP Kyoto
- Assignee: National Institute for Materials Science,Kyocera Corporation
- Current Assignee: National Institute for Materials Science,Kyocera Corporation
- Current Assignee Address: JP Ibaraki JP Kyoto
- Agency: Westerman, Hattori, Daniels & Adrian, LLP.
- Priority: JP2002-244895 20020826
- International Application: PCT/JP03/10575 WO 20030821
- International Announcement: WO2004/018743 WO 20040304
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
Disclosed are a diboride single crystal substrate which has a cleavage plane as same as that of a nitride compound semiconductor and is electrically conductive; a semiconductor laser diode and a semiconductor device using such a substrate and methods of their manufacture wherein the substrate is a single crystal substrate 1 of diboride XB2 (where X is either Zr or Ti) which is facially oriented in a (0001) plane 2 and has a thickness of 0.1 mm or less. The substrate 1 is permitted cleaving and splitting along a (10-10) plane 4 with ease. Using this substrate to form a semiconductor laser diode of a nitride compound, a vertical structure device can be realized. Resonant planes of a semiconductor laser diode with a minimum of loss can be fabricated by splitting the device in a direction parallel to the (10-10) plane. A method of manufacture that eliminates a margin of cutting is also realized.
Public/Granted literature
- US20060102924A1 Diboride single crystal substrate, semiconductor device using this and its manufacturing method Public/Granted day:2006-05-18
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